首页> 外文会议>2nd International EUSPEN Conference on Precision Engineering Nanotechnology Vol.2, May 27th-31st, 2001, Turin, Italy >Kinematics and Material Removal Mechanisms in Ultrasonic-Assisted Diamond Turning of Brittle Materials
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Kinematics and Material Removal Mechanisms in Ultrasonic-Assisted Diamond Turning of Brittle Materials

机译:脆性材料超声辅助金刚石车削的运动学和材料去除机理

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As demonstrated in earlier publications, the innovative technology of ultrasonic-assisted turning has already demonstrated the potential to bridge the gap between challenging materials such as steel and glass and ultraprecision machining with monocrystalline diamond tools. Now, extensive technological investigations of this process have been performed to identify the relevant parameters, which determine the material removal mechanisms for the ductile diamond turning of optical glass. In a first step the complex kinematics, which correspond to the combination of the constant spindle speed and the high-dynamic oscillation of the tool have been simulated. The material removal mechanisms have been identified on the basis of the results of these investigations.
机译:正如早期出版物中所证明的那样,超声波辅助车削的创新技术已经显示出弥合钢和玻璃等具有挑战性的材料与利用单晶金刚石工具进行超精密加工之间的差距的潜力。现在,已经对该工艺进行了广泛的技术研究,以确定相关参数,这些参数确定了光学玻璃的延性金刚石车削的材料去除机理。第一步,模拟了复杂的运动学,该运动学对应于恒定主轴转速和刀具的高动态振荡。根据这些调查结果确定了材料去除机制。

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