Ultraprecision Grinding of Large Silicon Wafer Using a Rotary Fast Tool Servo

摘要

The following is a summary of the results presented in this proceeding. (1) The RFTS, that would compensate the following error of the slide table and control the inclination of a grinding wheel, has been newly designed for grinding of silicon wafer. (2) The ultraprecision grinding machine for 300mm-diameter silicon wafer has been developed. Grinding process was established with the machine and the RFTS. (3) It was clarified that the RFTS provides two effective functions. One was reducing subsurface damage, the other was controlling the flatness of silicon wafer.