首页> 外文会议>2017 15th International Conference on Quality in Research : International Symposium on Electrical and Computer Engineering >Effect of Ge mole fraction on current, voltage and electric field characteristics of high doping nanoscale Si1−xGex/Si p-n diode
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Effect of Ge mole fraction on current, voltage and electric field characteristics of high doping nanoscale Si1−xGex/Si p-n diode

机译:Ge摩尔分数对高掺杂纳米Si 1-x Ge x / Si p-n二极管的电流,电压和电场特性的影响

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In this paper, we report the simulation of high doping nanoscale heterojunction diode, particularly Si1-xGex/Si p-n diode, using Cogenda Visual TCAD. In order to gain knowledge on electrical properties of this diode, we exhaustively simulate the effect of Ge mole fraction in SiGe material on current, voltage and electric field characteristics. The simulation covers Ge mole fraction of 0.2 to 0.7 in SiGe material as acceptor and Si material as donor. Both acceptor and donor have concentrations of 1020 per cm3 and areas of 10 × 10 nm2. Under forward bias voltage, higher Ge mole fraction will produce higher current. This phenomenon happens due to lower energy band gap at higher Ge mole fraction condition. Besides that, higher Ge mole fraction has lower energy difference between P side and N side of diode. According to the simulation result, Si0.8Ge0.2 has energy band gap about 0.8 eV, meanwhile Si0.3Ge0.7 has energy band gap about 0.5 eV. Lower energy band gap causes more electrons have enough energy to cross the junction. Meanwhile under reverse bias voltage, high doping nanoscale diode will produce infinitesimal current. At the junction, high doping nanoscale Si1-xGex/Si P-N diode also has lower electric field (measured at the center of diode) at higher Ge mole fraction. Under reverse bias voltage of -2 V, Si0.3Ge0.7 has maximum electric field about 5.89 × 106 V/m, meanwhile Si0.8Ge0.2 has maximum electric field about 6.17 × 106 V/m. We predict that Ge mole fraction has inversely proportional effect to the maximum electric field value. Therefore, we concluded that Ge mole fraction affects current, voltage and electric field characteristics of high doping nanoscale Si1-xGex/Si P-N diode.
机译:在本文中,我们报告了使用Cogenda Visual TCAD对高掺杂纳米级异质结二极管,特别是Si 1-x Ge x / Si p-n二极管的仿真。为了了解该二极管的电性能,我们详尽地模拟了SiGe材料中Ge摩尔分数对电流,电压和电场特性的影响。该模拟涵盖了以SiGe材料为受体和以Si材料为施主的0.2至0.7的Ge摩尔分数。受体和供体的浓度均为10 20 / cm 3 ,面积为10×10 nm 2 。在正向偏置电压下,较高的Ge摩尔分数将产生较高的电流。这种现象是由于在较高的Ge摩尔分数条件下较低的能带隙而发生的。除此之外,较高的Ge摩尔分数在二极管的P侧和N侧之间具有较低的能量差。根据仿真结果,Si 0.8 Ge 0.2 的能带隙约为0.8 eV,而Si0.3Ge0.7的能带隙约为0.5 eV。较低的能带隙导致更多的电子具有足够的能量穿过结。同时,在反向偏置电压下,高掺杂纳米级二极管将产生极小的电流。在结处,高掺杂的纳米级Si 1-x Ge x / Si P-N二极管在Ge摩尔分数较高时也具有较低的电场(在二极管中心测量)。在-2 V的反向偏置电压下,Si 0.3 Ge 0.7 的最大电场约为5.89×10 6 V / m,而Si < sub> 0.8 Ge 0.2 的最大电场约为6.17×10 6 V / m。我们预测锗摩尔分数与最大电场值成反比。因此,我们得出结论,锗摩尔分数会影响高掺杂纳米级Si 1-x Ge x / Si P-N二极管的电流,电压和电场特性。

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