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Physical mechanisms of magnetostriction or electrostriction induced interfacial fracture in a bi-layered multiferroic smart composite

机译:双层多铁智能复合材料中磁致伸缩或电致伸缩引起的界面断裂的物理机制

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摘要

The physical mechanisms of interfacial fracture in a multiferroic bimaterial under magnetostriction or electrostriction have been investigated by the methods of distributed dislocations and Green's function.The numerical results of the stress intensity factor are discussed and the physical mechanisms are then explained.
机译:通过磁致伸缩或电致伸缩方法研究了多铁双材料在磁致伸缩或电致伸缩作用下界面断裂的物理机理。讨论了应力强度因子的数值结果,并解释了其物理机理。

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